Akihiro Yabuki

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Hiroshima University

Japan

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Recent Grants

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The development of self-repairing weather-coating according to the nano-fiber composite of

Open Date: 2014-04-01

Close Date: 2017-03-31

Grant: Close

Development of self-healing anti-corrosion coatings using functional nanomaterials

Open Date: 2009-01-01

Close Date: 2011-12-31

Grant: Close

Development of self-healing hybrid agents using nanoparticle

Open Date: 2007-01-01

Close Date: 2008-12-31

Grant: Close

Preparation of nanocomposite polymer nanofiber using electrospinning method and its applications

Open Date: 2006-01-01

Close Date: 2009-12-31

Grant: Close

An investigation of flow parameters near material surface to predict unusual corrosion in piping system

Open Date: 2005-01-01

Close Date: 2006-12-31

Articles (8)

Year:

2024

Year:

2024

Year:

2024

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2022

Year:

2022

Year:

2021

Year:

2021

Year:

2020

Collaborators (2)

Riku Kawasaki

Assistant Professor

Hiroshima University

JAPAN

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JI HA LEE

Assitant Professor

Hiroshima University

JAPAN

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Akihiro Yabuki

Research Interests

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Contact this professor

Recent Grants

Articles (8)

Simple and facile synthesis of a CuS film using a copper formate–thioacetamide complex ink

Synthesis of copper sulfide (Cu S) films by one-step thermal reduction of copper formate–amine–sulfur complex pastes with low sulfur ratios

Controllable rheological properties of UV-responsive calix[4]arene gel for drug encapsulation and release

Electrochemical reduction of carbon dioxide to C2 products using a copper-sulfide, nanoparticle electrode synthesized by thermal decomposition of sulfur and copper-amine complex ink

Organic solvent-based thermo-electrochemical cells with an iron(ii/iii) triflate redox couple for use in harvesting low-grade waste heat at 100–200 °C

Self-reducible copper complex inks with two amines for copper conductive films via calcination below 100 °C

Effective release of corrosion inhibitor by cellulose nanofibers and zeolite particles in self-healing coatings for corrosion protection

Stable shape for copper film using low-temperature thermal decomposition of copper microparticles for printable electronics

Collaborators (2)

Riku Kawasaki

JI HA LEE

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