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Cong Huynh
Research Associate Prof.
University of Chicago
United States
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Research Interests
Tissue Engineering
40%
Polymer Physics
30%
Microencapsulation
30%
Hydrogel
30%
Liposome Technology
20%
Colloid Science
20%
Extracellular Vesicle
20%
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Articles4
Collaborators5
Eben Alsberg
Richard and Loan Hill Professor
University of Chicago
UNITED STATES
Hossein Moghimianavval
University of Michigan
UNITED STATES
Allen Liu
University of Michigan
UNITED STATES
Sung Won Hwang
department of electrical and computer engineering ajou university suwon 16499 republic of korea
SOUTH KOREA
Nicholas A. Kotov
University of Michigan
UNITED STATES
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