Dan Feng

About

Dr. Dan Feng is an Assistant Professor at Howard University in the United States. His research areas encompass the analysis of vibrations in manufacturing systems, particularly in the context of flexible and printed electronics. Recent publications include work on distinguishing between in-plane and out-of-plane vibrations, as well as innovations in measuring web tension in roll-to-roll manufacturing processes. Additionally, he explores bioinspired manufacturing techniques for aerogels, focusing on the manipulation of surface microstructures.