David Dunand

Professor

Northwestern University

United States

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David Dunand is a Professor at Northwestern University in the United States. His research focuses on materials science, particularly in the areas of high-entropy alloys, additive manufacturing, and the mechanical properties of various alloys. Recent publications include studies on the effects of alloy compositions and microstructures on material behavior, as well as advancements in thermoelectric materials and superconductor technologies.

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W. P. Murphy professor

Northwestern University

UNITED STATES

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David Dunand

Research Interests

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About

Articles (19)

Hierarchically Porous SnO2/Cu Composites via Freeze Casting and Selective Cu Reduction

Effect of Sc additions on precipitation behavior and creep- and coarsening resistance of a cast Al-4.5Cu-0.3Mg-0.4Ag (wt%) alloy

Co–Fe–Ni‐Based High‐Entropy Superalloys with γ/γ′ Microstructure

Additively-manufactured monocrystalline YBCO superconductor

Effect of Grain-boundary Phases on the Tensile and Compressive Creep Behavior of a Ni–Co Based Superalloy with High W Content

Effect of Eutectic Microstructure on Load Transfer and Creep Resistance in Al-Ce Alloys

Microstructure and properties of high-entropy-superalloy microlattices fabricated by direct ink writing

Tungsten Strongly Inhibits Sintering of Porous Iron During High‐Temperature Redox Cycling

Ink Casting and 3D‐Extrusion Printing of Yb<sub>14</sub>MnSb<sub>11</sub> for High‐Temperature Thermoelectric Material

Effect of Fe additions on microstructure and mechanical properties in near-eutectic Al–Ce alloys

Microstructure and mechanical properties of hypoeutectic Al–6Ce–3Ni-0.7Fe (wt.%) alloy

Creep properties and microstructure evolution at 260–300 °C of AlSi10Mg manufactured via laser powder-bed fusion

Microstructure and creep properties of cast near-eutectic Al–Ce–Ni alloys

Finite element modeling of creep deformation in dendritic alloys

Bulk Nanostructured Metal from Multiply-Twinned Nanowires

3D ink-printed, sintered porous silicon scaffolds for battery applications

Bi<sub>2</sub>Te<sub>3</sub> filaments via extrusion and pressureless sintering of Bi<sub>2</sub>Te<sub>3</sub>-based inks

Creep behavior and post-creep thermoelectric performance of the n-type Skutterudite alloy Yb<sub>0.3</sub>Co<sub>4</sub>Sb<sub>12</sub>

Effects of W micro-additions on precipitation kinetics and mechanical properties of an Al–Mn–Mo–Si–Zr–Sc–Er alloy

Collaborators (5)

Xiaobing Hu

Jeffrey Lopez

Ming Chen

Jiaxing Huang

David Seidman

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