Dominique Drouin
2 months ago
PhD in New Metallurgies for Low-Temperature Hybrid Bonding in Fan-Out Wafer Level Packaging Université de Sherbrooke in Canada
Degree Level
PhD
Field of study
Mechanical Engineering
Funding
Available
Deadline
Dec 30, 2026
Country
Canada
University
Université de Sherbrooke

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About this position
PhD opportunity at Université de Sherbrooke in advanced microelectronic packaging, focused on new metallurgies for low-temperature hybrid bonding in Fan-Out Wafer Level Packaging (FOWLP).
This doctoral project sits at the intersection of mechanical engineering, materials engineering, and chemical engineering, with a strong emphasis on microfabrication, surface characterization, metallurgy, polymers, and bonding process development. The research addresses a central challenge in next-generation packaging: copper-based hybrid bonding can suffer from oxidation and requires high processing temperatures. The project will explore alternative metallurgies and protection strategies to enable reliable low-temperature bonding for high-density interconnects.
The thesis aims to develop and characterize alternative metals for polymer-based hybrid bonding, optimize barrier layers or coatings for copper protection, and define die-to-wafer bonding conditions that produce a robust interface. The candidate will carry out morphological, electrical, and mechanical characterizations to assess adhesion quality and interface reliability. The work is expected to contribute to more compact, powerful microelectronic systems for applications such as artificial intelligence, aerospace, and high-performance computing.
The research will be conducted within the Interdisciplinary Institute for Technological Innovation (3IT) at Université de Sherbrooke and the C2MI in Bromont, in a collaborative environment with researchers, students, and industry partners. The project is supervised by Prof. Dominique Drouin as part of the IBM/NSERC Research Chair in Heterogeneous Multi Chip Integration for High Performance Computing. The position offers access to state-of-the-art facilities, cleanroom training, and multidisciplinary industrial research exposure.
Applicants should hold a Master’s degree or equivalent in mechanical engineering, nanotechnology, materials science, chemistry, or a related field. Strong experimental skills are expected, along with autonomy, adaptability, teamwork, and interest in innovation. French or English communication ability is required.
Application deadline: 30 December 2026. To apply, email [email protected].
Funding details
Available
What's required
A Master’s degree or equivalent in mechanical engineering, nanotechnology, materials science, chemistry, or a related field is required. Applicants should have skills in microfabrication, surface characterization, and knowledge of metallurgy and polymers. Desired personal qualities include autonomy, adaptability, strong teamwork, and a keen interest in experimental research and innovation. Knowledge of integration processes and advanced microelectronic packaging is an asset. Candidates must be able to communicate effectively in French or English, both orally and in writing.
How to apply
Email your application to [email protected]. Use the position title in the email subject line if possible. Follow any instructions provided by the institute or contact person if additional documents are requested.
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