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Dominique Drouin

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PhD in New Metallurgies for Low-Temperature Hybrid Bonding in Fan-Out Wafer Level Packaging Université de Sherbrooke in Canada

Degree Level

PhD

Field of study

Mechanical Engineering

Funding

Full funding available

Deadline

Dec 30, 2026

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Country

Canada

University

Université de Sherbrooke

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Keywords

Mechanical Engineering
Chemical Engineering
Metallurgy
Microfabrication
Microelectronics
Hydrogen Bonding

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About this position

PhD opportunity at Université de Sherbrooke in advanced microelectronic packaging, focused on new metallurgies for low-temperature hybrid bonding in Fan-Out Wafer Level Packaging (FOWLP).

This doctoral project sits at the intersection of mechanical engineering, materials engineering, and chemical engineering, with a strong emphasis on microfabrication, surface characterization, metallurgy, polymers, and bonding process development. The research addresses a central challenge in next-generation packaging: copper-based hybrid bonding can suffer from oxidation and requires high processing temperatures. The project will explore alternative metallurgies and protection strategies to enable reliable low-temperature bonding for high-density interconnects.

The thesis aims to develop and characterize alternative metals for polymer-based hybrid bonding, optimize barrier layers or coatings for copper protection, and define die-to-wafer bonding conditions that produce a robust interface. The candidate will carry out morphological, electrical, and mechanical characterizations to assess adhesion quality and interface reliability. The work is expected to contribute to more compact, powerful microelectronic systems for applications such as artificial intelligence, aerospace, and high-performance computing.

The research will be conducted within the Interdisciplinary Institute for Technological Innovation (3IT) at Université de Sherbrooke and the C2MI in Bromont, in a collaborative environment with researchers, students, and industry partners. The project is supervised by Prof. Dominique Drouin as part of the IBM/NSERC Research Chair in Heterogeneous Multi Chip Integration for High Performance Computing. The position offers access to state-of-the-art facilities, cleanroom training, and multidisciplinary industrial research exposure.

Applicants should hold a Master’s degree or equivalent in mechanical engineering, nanotechnology, materials science, chemistry, or a related field. Strong experimental skills are expected, along with autonomy, adaptability, teamwork, and interest in innovation. French or English communication ability is required.

Application deadline: 30 December 2026. To apply, email [email protected].

Funding details

Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.

How to apply

Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.

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