Eun-Ho Lee

Assistant Professor

Sungkyunkwan University

South Korea

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About

Dr. Eun-Ho Lee is an Assistant Professor at Sungkyunkwan University in South Korea. His research focuses on materials science and engineering, with recent articles addressing topics such as high-performance lithium-ion batteries, plastic deformation, and the thermal properties of materials. His innovative work includes the development of wearable electronics and advanced semiconductor packaging methodologies.

Articles (29)

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2021

Collaborators (4)

Jung Heon Lee

Professor

Sungkyunkwan University

SOUTH KOREA

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Seungik Baek

Associate Professor

Michigan State University

UNITED STATES

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Young-Dae Shim

Sungkyunkwan University

SOUTH KOREA

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Dongtak Lee

Assistant Professor

Incheon National University

SOUTH KOREA

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Eun-Ho Lee

Research Interests

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About

Articles (29)

Microscale Tin–Bismuth Alloy Prepared via Cooling Rate Control as Anode Material for High‐Performance Lithium‐Ion Batteries

A Skew-Symmetric Plastic Potential Model for Material Processing Lagrangian Formulation

Bio-inspired single-step DNA-patterned APC-PTFE hybrid resistive strain sensor with high stretchability and stability for wearable electronics

Phase-segregated SnSb alloy anode for lithium-ion battery

A mathematical investigation of the influence of physical parameters on local surface heat flux of thin films

Pure Mechanical Impact Trimming for Ultra High-strength Steels: A Strain Rate-managed Approach to Enhance Shear Edge Quality Without Thermal Effects

Integrated modeling framework for the interactions of plastic deformation, magnetic fields, and electrical circuits: Theory and applications to physics-informed real-time material monitoring

Image-Based Accelerated Prediction of Thermal Properties of Package Substrates Using Combined Deep-Learning and an Enhanced Thermal Network Model

Investigation of Plastic Deformation and Electromagnetic Interaction for Copper Losses Caused by Hairpin Motor Manufacturing

Thermodynamic modeling framework with experimental investigation of the large-scale bonded area and local void in Cu-Cu bonding interface for advanced semiconductor packaging

Practical fracture limit function considering data flexibility under plane-stress conditions in Lagrangian formulation

Influence of heat transfer at the graphene–polyimide interface on laser-induced graphene formation

Monolithic DNApatite: An Elastic Apatite with Sub‐Nanometer Scale Organo–Inorganic Structures

Effect of formulation method for plastic deformation rate on topology optimization considering elastic-plastic behavior

Numerical analysis of thermal and mechanical characteristics with property maps in complex semiconductor package designs

Multi-scaled temporal modeling of cardiovascular disease progression: An illustration of proximal arteries in pulmonary hypertension

Development of Roll Tapping Machine Capable of Synchronized Control of Spindle Rotation and Feeding Speed

Relativistic constitutive modeling of inelastic deformation of continua moving in space-time

Effective thermo-electric-mechanical modeling of capacitively coupled plasma in low-pressure conditions: Modeling and application in dry etching

Correlation between parameters in the microstructural vector theory and Hill's plastic potential

Implicit Integration Algorithm for Solving Evolution of Microstructural Vectors Based on Eulerian Formulation in Plane Stress Condition

An Effective Formability Model of Pearlitic Steel Wires in Multi-stage Drawing Process Based on the Stress-Based Forming Limit Criterion

Eulerian constitutive equations for the coupled influences of anisotropic yielding, the Bauschinger effect and the strength-differential effect for plane stress

A New Approach to Modeling Focused Infrared Heating Based on Quantum Mechanical Formulations

A New Mechanical Cold Trimming Process Assisted by Dashed Lined Infrared Heat Treatment of Martensitic Steel Considering Energy Efficiency

A Simplified Anisotropic Yield Function not Requiring Parameter Optimization for Sheet Metals

Application of Convolutional Neural Network to Predict Anisotropic Effective Thermal Conductivity of Semiconductor Package

A model for irreversible deformation phenomena driven by hydrostatic stress, deviatoric stress and an externally applied field

Asymptotic profile of solutions to the heat equation on thin plate with boundary heating

Collaborators (4)

Jung Heon Lee

Seungik Baek

Young-Dae Shim

Dongtak Lee

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