JAYESH SHANTHI BHAVAN

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Coventry University

United Kingdom

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Dynamic Characteristics and Dynamic Response Characteristics of A Board Level Electronic Package Under Random Vibration

Open Date: 2013-06-01

Close Date: 2014-06-01

Articles (16)

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Collaborators (3)

Unnikrishnan T G

Lecturer

Luther College

UNITED KINGDOM

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Ashwath Pazhani

Coventry University

UNITED KINGDOM

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Arivazhagan Anbalagan

Coventry University

UNITED KINGDOM

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JAYESH SHANTHI BHAVAN

Research Interests

Explore related searches

Contact this professor

Recent Grants

Articles (16)

Design, Development, and Performance Evaluation of a Lightweight Short Shifter for Enhanced Gear-Shifting Quality in Automobile

EBSD characterization of Ag3Sn phase transformation in Sn–Ag lead-free solder alloys: a comparative study before and after heat treatment

Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag3Sn Phase

Stress Corrosion Cracking of MIG Welded Mild Steel Joints in 3.5% NaCl Solution Under Different Loads

EBSD characterization of graphene nano sheet reinforced Sn–Ag solder alloy composites

Small-angle neutron scattering analysis in Sn-Ag Lead-free solder alloys

Synthesis and characterisation of graphene-reinforced AA 2014 MMC using squeeze casting method for lightweight aerospace structural applications

Identification and recovery of rare earth elements from electronic waste

Road traffic accidents

Investigations on the Corrosion Properties of Sn–0.5Cu–Bi–xAg Lead Free Solder Alloys in 3.5% NaCl Solution

Analysing the Covid-19 Cases in Kerala: a Visual Exploratory Data Analysis Approach

Experimental and finite element analysis on determining the fatigue life of pb-free solder joint (Sn-0.5Cu-3Bi-1Ag) used in electronic packages under harmonic loads

Experimental Investigations on Impact Toughness and Shear Strength of Novel Lead Free Solder Alloy Sn-1Cu-1Ni-XAg

Experimental Investigations on Impact Toughness and Shear Strength of Lead Free Solder Alloy Sn–0.5Cu–3Bi–xAg

Experimental Investigation on the Effect of Ag Addition on Ternary Lead Free Solder Alloy –Sn–0.5Cu–3Bi

Factorial design and design of experiments for developing novel lead free solder alloy with Sn, Cu and Ni

Collaborators (3)

Unnikrishnan T G

Ashwath Pazhani

Arivazhagan Anbalagan

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