Jihoon Seo

Assistant Professor

Clarkson University

United States

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About

Jihoon Seo is an Assistant Professor at Clarkson University, specializing in advancements related to chemical mechanical planarization (CMP) and lithium-ion battery technologies. His research encompasses eco-friendly processes, kinetic optimization of materials, and atomic-level interactions in CMP. Recent publications highlight trends in reducing environmental impact and enhancing performance in various electrochemical applications. He is based in the United States.

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Collaborators (4)

Euigyung Jeong

Associate Professor

Kyungpook National University

SOUTH KOREA

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Panart Khajornrungruang

Associate Professor

Kyushu Institute of Technology

JAPAN

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Sitaraman Krishnan

Professor

Clarkson University

UNITED STATES

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Goodarz Ahmadi

UNITED STATES

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Jihoon Seo

Research Interests

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About

Articles (28)

Toward Eco-Friendly CMP Process: Emerging Trends and Strategies for Reducing Environmental Footprint

Review on atomistic and quantum mechanical simulation approaches in chemical mechanical planarization

Anode SHIELD: A Surface Hybrid Interlayer for High‐Capacity Anodes Toward Safe and Stable Lithium‐Ion Batteries

Boosting selenium cathode performance through kinetic optimization

Role of amino acid-based inhibitors in the dynamic electrochemical behavior of Cu and Co during chemical mechanical planarization

Direct Observation of Sub-100 nm Silica Particle Detachment: Lateral Force and Evanescent Microscope Study

Revisiting the Roles of Chelator, Inhibitor, Oxidant, and Abrasive in High-Rate Copper CMP

Tailored electrostatic attraction force between anionic polymer and Si3N4 film in consecutive gate poly open CMP

Enhancing dispersion stability and recyclability of ceria slurry with polyacrylic acid for improved glass polishing performance

Detachment Energy Evaluation in Nano-Particle Cleaning Using Lateral Force Microscopy

Environmental Impact Assessment of Chemical Mechanical Planarization Consumables: Challenges, Future Needs, and Perspectives

Atomic-level insights into CeO2 performance: Chemical interactions in CMP explored through CeO2-SiO2 studies

Directing the uniform and dense Li deposition via graphene-enhanced separators for high-stability Li metal batteries

Structural dependency of pyridine carboxylic acid isomers in metal-organic coordination adsorption for copper corrosion inhibition

Comparative first-principles analysis of crystalline versus amorphous CeO2 particles: implications for chemical mechanical planarization

Development of Highly stable ceria slurry in acetic acid-ammonium acetate buffer Media for effective chemical mechanical polishing of silicon dioxide

Synergistically enhanced LiF–rich protective layer for highly stable silicon anodes

Enhancing CMP Performance of Micro-Structured Pad Patterns: CFD Simulations and Experimental Evaluations

Examining Leucine As an Environmentally Friendly Corrosion Inhibitor for Cu and Co Chemical-Mechanical Planarization (CMP)

Perspective—Recent Advances and Thoughts on Ceria Particle Applications in Chemical Mechanical Planarization

Measurement of the force required to move ceria particles from SiO2 surfaces using lateral force microscopy

Suppression of Dissolution Rate via Coordination Complex in Tungsten Chemical Mechanical Planarization

Storage Temperature Effects on the Slurry Health Parameters and SiO2 Removal Rates during Chemical Mechanical Polishing

Real-Time Visualization of the Cleaning of Ceria Particles from Silicon Dioxide Films Using PVA Brush Scrubbing

Challenges and Solutions for Post-CMP Cleaning of Ceria Particles for Advanced Technology Nodes

Direct Observation of Adsorption of Ceria Particles on the Silicon Dioxide Surfaces and Their Removal

3D trajectories and diffusion of single ceria particles near a glass surface and their removal

A review on chemical and mechanical phenomena at the wafer interface during chemical mechanical planarization

Collaborators (4)

Euigyung Jeong

Panart Khajornrungruang

Sitaraman Krishnan

Goodarz Ahmadi

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