Jiri Hlina

University of West Bohemia

Czech Republic

Research Interests

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Articles (5)

Year:

2024

Year:

2022

Year:

2022

Year:

2021

Year:

2020

Collaborators (3)

Ales Hamacek

Head of Department of Materials and Technologies

University of West Bohemia

CZECH REPUBLIC

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Jan Reboun

senior researcher, associate profesor

Západočeská univerzita v Plzni

CZECH REPUBLIC

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Martin Janda

University of West Bohemia

CZECH REPUBLIC

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Jiri Hlina

Research Interests

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Articles (5)

Investigation of cooling capability of ceramic substrates for power electronics applications

Study of Internal Stress in Conductive and Dielectric Thick Films

Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper

Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications

Study of copper thick film metallization on aluminum nitride

Collaborators (3)

Ales Hamacek

Jan Reboun

Martin Janda

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