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José Vallepuga-Espinosa

Universidad de León

Spain

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Research Interests

Solid Mechanics

40%

Condensed Matter Physics

20%

Contact Mechanics

40%

Computational Mechanics

30%

Thermoelasticity

30%

Micromechanics

20%

Thermal Convection

20%

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Articles5

3D thermoelastic solids under non‐linear interface thermal and orthotropic frictional contact conditions

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Year:

2022

Thermomechanical Optimization of Three-Dimensional Low Heat Generation Microelectronic Packaging Using the Boundary Element Method

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Year:

2022

Non-linear interface thermal conditions in three-dimensional thermoelastic contact problems

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Year:

2020

Thermoelastic influence of convective and conduction interstitial conditions on the size of the contact zone in three-dimensional receding thermoelastic contact problem

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Year:

2020

A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging

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Year:

2020

Collaborators3

Iván Ubero-Martínez

Universidad de León

SPAIN

Luis Rodríguez de Tembleque

Associate Professor

Universidad de Sevilla

SPAIN

Jaime Cifuentes-Rodriguez

Universidad de Valladolid Escuela de Ingenierías Industriales

SPAIN

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