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Kamil Gradkowski

Senior Researcher II

Tyndall National Institute

Ireland

Research Interests

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Professors in Ireland

Articles (20)

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2026

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2025

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2023

Collaborators (4)

Yevhenii Morozov

AIT Austrian Institute of Technology GmbH

AUSTRIA

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Brian Corbett

University College Cork

IRELAND

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Stefan Andersson-Engels

Professor

University College Cork

IRELAND

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Dana Seyringer

Senior Scientist

Vorarlberg University of Applied Sciences

AUSTRIA

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Kamil Gradkowski

Research Interests

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Articles (20)

Towards all optically powered miniature devices in remote locations of the body

Exploring Heterogeneous Integration of Thick Micro-Lens Array for Pluggable Photonics Packaging

Chip-agnostic optical packaging of photonic integrated circuits using refractive micro-optics

Innovations in fibre array coupling and integration for high-bandwidth FPGA multichip packages

Mixed-Mode Fiber Array Alignment and Coupling to Photonic Integrated Circuits

Out-of-Plane Optical Coupling to Photonic Integrated Circuits Using Turning-Mirror Lens Arrays

Recent advances in fiber-to-PIC packaging technologies for scalable manufacturing

Scalable low-loss cryogenic packaging of quantum memories in CMOS-foundry processed photonic chips

Solder-Reflow Resistant Thermoplastic for Optical Coupling

Thermal and Electrical Study of Glass Interposers in Co-Packaged Electronic-Photonic Systems

VR simulation and digital twin based training for workforce development in integrated photonics

Silicon nitride photonic integrated circuits for optical coherence tomography

Balanced-detection interferometric cavity-assisted photothermal spectroscopy via collimating fiber-array integration

Etching-Free Fabrication and Integration of 45° Micro-Mirror for Surface-Compatible Photonic Packaging

Micro-transfer printing of thick optical components using a tether-free UV-curable approach

Packaging of micro-lens arrays to photonic integrated circuits using beam shape evaluation

Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages

Tolerances of the alignment of fibers to photonic integrated circuits

Packaging and test technologies

3D-printed facet-attached microlenses for advanced photonic system assembly

Collaborators (4)

Yevhenii Morozov

Brian Corbett

Stefan Andersson-Engels

Dana Seyringer

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