Katsuya Kikuchi

National Institute of Advanced Industrial Science and Technology (AIST)

Japan

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Articles (8)

Year:

2023

Year:

2023

Year:

2023

Year:

2022

Year:

2022

Year:

2021

Year:

2021

Year:

2020

Collaborators (3)

Makoto Nagata

Kobe University

JAPAN

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Hirotake Yamamori

National Institute of Advanced Industrial Science and Technology (AIST)

JAPAN

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Takuji Miki

Kobe University

JAPAN

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Katsuya Kikuchi

Research Interests

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Articles (8)

Nb–Nb direct bonding at room temperature for superconducting interconnects

Wafer-to-Wafer Bonding Fabrication Process-Induced Wafer Warpage

(Invited) Direct Bonding and Its Interface for High-Density Integration of Superconducting Qubits

Warpage Reduction and Thermal Stress Study of Dicing Process in Wafer-to-Wafer Bonding Fabrication

In-Place Evaluation of Powering and Signaling Within Fan-Out Multiple IC Chip Packaging

Thermal management of a 3D packaging structure for superconducting quantum annealing machines

3-D CMOS Chip Stacking for Security ICs Featuring Backside Buried Metal Power Delivery Networks With Distributed Capacitance

Si-Backside Protection Circuits Against Physical Security Attacks on Flip-Chip Devices

Collaborators (3)

Makoto Nagata

Hirotake Yamamori

Takuji Miki

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