Petr Vesely

Assistant Professor

Czech Technical University in Prague, Faculty of Electrical Engineering

Czech Republic

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About

Petr Vesely is an Assistant Professor at the Czech Technical University in Prague, Faculty of Electrical Engineering. His research areas include dielectric materials, biodegradable substrates for circuit boards, and solder joint microstructure. He has published articles on topics such as the characterization of photocurable resins, the influence of solder mask on electrochemical migration, and the application of solid-phase microextraction for volatile organic compounds.

Articles (15)

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2025

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2025

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2024

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2024

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2024

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2023

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2023

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2023

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2022

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2022

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2021

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2021

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2021

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2021

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2020

Collaborators (4)

Attila Géczy

Budapest University of Technology and Economics

HUNGARY

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Csaba Farkas

Budapest University of Technology and Economics

HUNGARY

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Balazs Illes

Budapest University of Technology and Economics

HUNGARY

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Jonáš Uřičář

University of Chemistry and Technology, Prague

CZECH REPUBLIC

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Petr Vesely

Research Interests

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About

Articles (15)

Biodegradable Substrates for Rigid and Flexible Circuit Boards: A Review

Characterization of BTO ceramic composite photocurable resin for dielectric applications

Wettability in lead-free soldering: Effect of plasma treatment in dependence on flux type

SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux

Influence of Solder Mask on Electrochemical Migration on Printed Circuit Boards

Application of solid-phase microextraction arrows for characterizing volatile organic compounds from 3D printing of acrylonitrile-styrene-acrylate filament

Analysis of solder mask roughness and stencil shape influence on void formation in solder joints

Dielectric spectroscopy of PETG/TiO2 composite intended for 3D printing

Understanding the Effect of Reflow Profile on the Metallurgical Properties of Tin–Bismuth Solders

Biodegradable and Nanocomposite Materials as Printed Circuit Substrates: A Mini-Review

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

Mathematical Modelling of Temperature Distribution in Selected Parts of FFF Printer during 3D Printing Process

Investigation of Impacts on Printed Circuit Board Laminated Composites Caused by Surface Finish Application

Analysis of a failure in a molded package caused by electrochemical migration

Analysis of no-clean flux spatter during the soldering process

Collaborators (4)

Attila Géczy

Csaba Farkas

Balazs Illes

Jonáš Uřičář

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