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Shang Wang

Harbin Institute of Technology

China

Research Interests

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Articles (20)

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Collaborators (5)

Lijie Ci

Full Professor

Harbin Institute of Technology

CHINA

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Qing Sun

Researcher

Institut de Recerca en Energìa de Catalunya

SPAIN

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Guifang Zeng

Institut de Recerca en Energìa de Catalunya

SPAIN

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andreu cabot

Institut de Recerca en Energìa de Catalunya

SPAIN

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Yanhong Tian

Professor

Harbin Institute of Technology

CHINA

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Shang Wang

Research Interests

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Articles (20)

Advancing Lithium–Oxygen Batteries: Pioneering Cathode Catalyst Innovation and Artificial Intelligence‐Driven Design Paradigms

Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic Packaging

A self-attentive physics-informed and data-driven framework for predicting solder joint reliability in printed circuit board assemblies under thermal aging

Crystal Growth Engineering for Dendrite‐Free Zinc Metal Plating

Modulating the solvation structure to enhance amorphous solid electrolyte interface formation for ultra-stable aqueous zinc anode

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Non‐Flammable Electrolytes for Safe Lithium‐, Sodium‐, and Potassium‐Ion Batteries

Femtosecond Laser Irradiation Induced Heterojunctions Between Graphene Oxide and Silver Nanowires

Role of Hetero‐Doped Reduced Graphene Oxide in Suppressing Elemental Dissolution in Manganese Selenide Cathode for Aqueous Zinc‐Ion Batteries

Anchoring sulfur migration to mitigate Kirkendall voids in nano-twinned copper interconnections for robust and reliable packaging

High-precision electrohydrodynamic printing of EGaIn-AgNPs biphasic conductive ink for conformal and lightweight bioelectrodes

Iridium Cluster Decoration on Amorphous Cobalt Oxide-Coated Carbon Nanotubes for High-Performance Lithium-Oxygen Battery Cathodes

Precision Control of Aerosol Jet Printing for Conformal Electronics Fabrication with Ultra-Fine and Wide-Range Resolution

Quality control and reliability of PQFP device solder joints

Reliability optimization of solder joints in large-sized COTS devices based on solder mask layer design,基于阻焊层设计的大尺寸 COTS 器件焊点可靠性优化

SnPbInBiSb high-entropy solder joints with inhibited interfacial IMC growth and high shear strength

Thermal-electrical coupling effect on the reliability of copper pillar bump joints with different initial IMC thickness and microstructure

Special Issue “Synthesis, Characterization and Performance Enhancement of Electrode and Biomaterial Coatings”

A Manufacturing Method for High-Reliability Multilayer Flexible Electronics by Electrohydrodynamic Printing

Are Sulfide-Based Solid-State Electrolytes the Best Pair for Si Anodes in Li-Ion Batteries?

Collaborators (5)

Lijie Ci

Qing Sun

Guifang Zeng

andreu cabot

Yanhong Tian

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