Thomas Stieglitz
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Articles (19)
Year:
2024
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2024
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2024
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2024
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2024
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2024
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2024
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2023
The success of bioelectronics medicine with neural implants inevitably depends on the longevity of neural interfaces where a full understanding of the associated risks serves as the first step, to begin with. Until now, failure of neural electrodes is primarily explained by extreme electrochemical reactions, whereas no direct link between electrical stimulation and mechanical deformation of microelectrodes can be proved. The research provides new quantitative evidence of electrically induced mechanical vibrations in thin film neural interfaces. This study investigates the dynamic changes in intrinsic mechanical stress in clinically used neural electrodes under electrical stimulation. Via live imaging of the electrode plane, the deformation and progressive adhesion loss of the thin film during stimulation is for the first time approved. The results reveal nano‐oscillations in the interfaces under alternating current. This hints at a direct link between electrochemical charge transfer and mechanical stability. Considering neural interfaces as resonating actuators serves as a key to assessing the stability of neural interfaces and a valuable input to a longstanding question on the associated failure mechanisms of thin film microelectrodes. It is believed, that the outcome of this work may significantly contribute to improving the future design of thin film neural interfaces and better conditioning them for life‐long reliability.
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2023
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2023
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2023
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2023
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2023
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2022
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2022
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2022
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2022
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2022
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2022
Collaborators (11)
Mátè Döbrössy
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Alexandre Ferreira da Silva
University of Minho
Ulrich Hofmann
Professor
University Medical Center Freiburg
Stanisa Raspopovic
Assistant Professor
Swiss Federal Institute of Technology in Zurich
Fabio Biscarini
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Xavier Navarro
Professor
University of Barcelona
Günther Zeck
TU Wien
Tobias Moser
Max Planck Institute for Multidisciplinary Sciences
Giacomo Valle
Assistant Professor at Chalmers University of Technology
Chalmers University of Technology
Danesh Ashouri Vajari
University of Freiburg
Pierpaolo Greco
University of Ferrara
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