Tiwei Wei

Assistant Professor

Purdue University

United States

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About

Tiwei Wei is an Assistant Professor at Purdue University West Lafayette, USA. His research focuses on advanced cooling solutions for high-density electronic systems, including direct-on-chip cooling and multiscale thermal management strategies. Recent publications highlight his work on jet impingement cooling, thermal modeling, and the performance of advanced manufacturing techniques, particularly in the context of interposers and cooling apparatus for integrated systems.

Articles (15)

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2025

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2025

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2025

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2025

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2025

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2024

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2024

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2022

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2022

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2021

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2021

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2020

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2020

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Tiwei Wei

Research Interests

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About

Articles (15)

Direct-on-chip two-phase jet impingement cooling of multichip packages: Distributed inlet-outlet nozzles

Double-Sided Copper Filling of Small Diameter, High-Aspect Ratio Through-Glass Vias in High-Density Glass Interposers

Multi-chip Jet impingement cooling for heat dissipation in 2.5D integrated system with 1 kW+ thermal design power

Exploring Efficient Thermal Management Solutions for Backside Power Delivery Network (BSPDN) Systems Using Multiscale Modeling

Experimental Investigation of a Compact Lid-Compatible Multijet Impingement Manifold for Direct-On-Chip Cooling

Scaling effects on the microstructure and thermomechanical response of through silicon vias (TSVs)

Evidence of non-isentropic release from high residual temperatures in shocked metals measured with ultrafast x-ray diffraction

Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling

Numerical modelling and analysis of porous surface-enhanced jet cooling using copper inverse opals in single-phase flow

Parametric design analysis of a multi-level 3D manifolded microchannel cooler via reduced order numerical modeling

Heat transfer and pressure drop correlations for direct on-chip microscale jet impingement cooling with alternating feeding and draining jets

Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications

Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications

Low-Cost Energy-Efficient On-Chip Hotspot Targeted Microjet Cooling for High- Power Electronics

Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5D integrated systems

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