Vesa Vuorinen

Senior University Lecturer

Aalto-yliopisto

Finland

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Vesa Vuorinen is a Senior University Lecturer at Aalto-yliopisto Sähkötekniikan korkeakoulu in Finland. His research focuses on low-temperature interconnect technologies, particularly related to 3-D MEMS packaging, and methodologies for wafer level metal bonding. His recent publications address advancements in solid-liquid interdiffusion processes and the reliability of different interconnect materials and designs.

Articles (12)

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2025

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2025

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2024

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2024

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2024

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2024

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2023

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2023

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2023

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2022

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2022

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2021

Collaborators (4)

Nikhilendu Tiwary

Aalto University

FINLAND

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Glenn Ross

Aalto University

FINLAND

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Josef Lutz

Full Professor

Chemnitz University of Technology

GERMANY

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Obert Golim

Aalto University

FINLAND

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Vesa Vuorinen

Research Interests

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About

Articles (12)

Facilitating Small-Pitch Interconnects With Low-Temperature Solid-Liquid Interdiffusion Bonding

Low-Temperature SLID-TSV Interconnects for 3-D (MEMS) Packaging

Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test

Review—Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration

Novel Low-Temperature Interconnects for 2.5-/3-D MEMS Integration: Demonstration and Reliability

Bonding of ceramics to silver‐coated titanium—A combined theoretical and experimental study

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs

Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics

Finite element simulation of solid-liquid interdiffusion bonding process

Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding

Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures

Collaborators (4)

Nikhilendu Tiwary

Glenn Ross

Josef Lutz

Obert Golim

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