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Yingxia Liu

City University of Hong Kong

Hong Kong

Research Interests

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Articles (20)

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2026

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2025

Collaborators (3)

Waichon Lio

Associate Professor

Beihang University

CHINA

View details

Qiyuan He

Assistant Professor

City University of Hong Kong

HONG KONG

View details

铠丰王

assistant professor

Shenzhen University

CHINA

View details

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Yingxia Liu

Research Interests

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Articles (20)

Physics-based degradation modeling and belief reliability analysis for solder joint pancake-type void

Fast Cu-Cu pillar array bonding by thermally stable nanocrystalline Cu

A mixed crystal structure for the investigation of Cu-Cu bonding

Defects in Cu-filled through-silicon vias (TSV) after thermal cycling

Machine learning assisted multiphysics simulation for electroplating copper in high aspect ratio through silicon via

Barrier effect of Sn-Bi-In multi-principal element solder on thermomigration

Degradation process modeling and data-driven lifetime prediction for BGA specimen during small sample electromigration test

The study of rapid Cu–Cu bonding using thermally stable nanostructured Cu layers

h-BN-based lamellar films with ultralow dielectric constant and high thermal conductivity

Investigation of bottom-up electrodeposition filling for nanoscale through-silicon vias (TSVs)

Novel accelerated failure mode of eutectic SnBi Solder joints under simultaneous electromigration and temperature cycling test

Effect of WC thickness on the microstructure and properties of WC-C/DLC coated 304 steel

Fabrication of high-density microbump arrays using SnIn nanoparticles

Investigating the Oxidation Resistance of Nanosized SnBiIn Solder Through TEM Analysis

Shape Effect Study of Copper Redistribution Layer in Electromigration Tests under Humidity

Study of Geopolymer Adhesive Bonding with Alumina Ceramics for DUV LED Packaging

Thermomigration of Au in the Microbump

A controllable salting-out engineering strategy to promote the anisotropic thermal conductivity performances of BNNS@PVA aerogel-based composites by constructing thermal transfer network

The anti-electrochemical migration mechanism of Ag-based transient liquid-phase electrically conductive adhesive

Geopolymer adhesives for DUV LED packaging

Collaborators (3)

Waichon Lio

Qiyuan He

铠丰王

Make your next move.

Yingxia Liu

Research Interests

Make your next move.

Articles (20)

Physics-based degradation modeling and belief reliability analysis for solder joint pancake-type void

Fast Cu-Cu pillar array bonding by thermally stable nanocrystalline Cu

A mixed crystal structure for the investigation of Cu-Cu bonding

Defects in Cu-filled through-silicon vias (TSV) after thermal cycling

Machine learning assisted multiphysics simulation for electroplating copper in high aspect ratio through silicon via

Barrier effect of Sn-Bi-In multi-principal element solder on thermomigration

Degradation process modeling and data-driven lifetime prediction for BGA specimen during small sample electromigration test

The study of rapid Cu–Cu bonding using thermally stable nanostructured Cu layers

h-BN-based lamellar films with ultralow dielectric constant and high thermal conductivity

Investigation of bottom-up electrodeposition filling for nanoscale through-silicon vias (TSVs)

Novel accelerated failure mode of eutectic SnBi Solder joints under simultaneous electromigration and temperature cycling test

Effect of WC thickness on the microstructure and properties of WC-C/DLC coated 304 steel

Fabrication of high-density microbump arrays using SnIn nanoparticles

Investigating the Oxidation Resistance of Nanosized SnBiIn Solder Through TEM Analysis

Shape Effect Study of Copper Redistribution Layer in Electromigration Tests under Humidity

Study of Geopolymer Adhesive Bonding with Alumina Ceramics for DUV LED Packaging

Thermomigration of Au in the Microbump

A controllable salting-out engineering strategy to promote the anisotropic thermal conductivity performances of BNNS@PVA aerogel-based composites by constructing thermal transfer network

The anti-electrochemical migration mechanism of Ag-based transient liquid-phase electrically conductive adhesive

Geopolymer adhesives for DUV LED packaging

Collaborators (3)

Waichon Lio

Qiyuan He

铠丰 王

Make your next move.

铠丰王