Yu Sekiguchi

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Assistant Professor

Tokyo Institute of Technology

Japan

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Recent Grants

Grant: Close

生体模倣型の液架橋形成と氷による可逆接合を併用した把持力制御による物体操作技術

Open Date: 2021-04-01

Close Date: 2024-03-31

Grant: Close

Study on micro-manipulation using adhesion force control

Open Date: 2018-04-01

Close Date: 2021-03-31

Grant: Close

ヤモリ模倣凝着デバイスの形状傾斜化による着脱機能・表面粗さ吸収機能の両立

Open Date: 2015-04-01

Close Date: 2018-03-31

Grant: Close

Development of bio-inspired adhesive attachment-and-detachment devices

Open Date: 2013-08-30

Close Date: 2015-03-31

Articles (15)

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2024

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2023

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2023

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2022

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2022

Collaborators (4)

Ming JI

Tokyo Institute of Technology

JAPAN

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keiji houjou

National Institute of Advanced Industrial Science and Technology

JAPAN

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HARUHISA AKIYAMA

National Institute of Advanced Industrial Science and Technology

JAPAN

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José Machado

Professor Auxiliar

Universidade do Porto Faculdade de Engenharia

PORTUGAL

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Yu Sekiguchi

Research Interests

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Recent Grants

Articles (15)

Experimental investigation of moisture penetration in adhesive layers under varying bonding conditions using near-infrared spectroscopy

Analytical Calculation of Relationship Temperature and Fatigue and Creep Strength Based on Thermal Activation

Spectral collocation method for free vibration of sandwich plates containing a viscoelastic core

Experimental approach for measuring the peeling strength of a sheet bonded on a curved adherend with pressure sensitive adhesive and predicting the peeling resistance by finite element analysis

A butt shear joint (BSJ) specimen for high throughput testing of adhesive bonds

Forward and inverse analysis of transient responses for a cantilevered rectangular plate under normal and oblique impact loadings

Inverse design of composite xylophone beams using finite element-based machine learning

Analyzing Deformation of a Cationic Photopolymerized Epoxy Adhesive during the Curing Process in UV Irradiation and Dark Reaction based on Finite Element Method and Measurement

Experimental measurement of moisture distribution in the adhesive layer using near‐infrared spectroscopy

Effects of low temperatures and high strain rates on the tensile properties of polyurethane polymers for adhesives

Two‐parameter analysis of fatigue crack growth behavior in structural acrylic adhesive joints

Creep Crack Growth Behavior during Hot Water Immersion of an Epoxy Adhesive Using a Spring-Loaded Double Cantilever Beam Test Method

A high-throughput technique to evaluate the probability distribution of strength of adhesively bonded joints after moisture absorption

Effect of temperature and loading rate on the mode I fracture energy of structural acrylic adhesives

Energy release rate and crack propagation rate behaviour of moisture-deteriorated epoxy adhesives through the double cantilever beam method

Collaborators (4)

Ming JI

keiji houjou

HARUHISA AKIYAMA

José Machado

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