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source

Higher Education Council of Rwanda

Tuition Waiver

MOFCOM Scholarship

Fully Funded MOFCOM Scholarships for Master’s and PhD Programmes in China (2026–2027) Higher Education Council of Rwanda in Canada

Degree Level

Master's, PhD

Field of study

Computer Science

Funding

Full funding available

Deadline

Expired

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Country

Canada

University

Higher Education Council of Rwanda

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Keywords

Computer Science
Education
Environmental Science
Agriculture
Electrical Engineering
Information Technology
Artificial Intelligence
International Relations
Public Administration
Accounting
Business
Journalism
Digital Media
Ecosystem Management
Management
Salud Pública
Law
Educational Leadership
Technical Engineering
China

About this position

Fully funded MOFCOM Scholarship opportunity for Master’s and PhD study in China for the 2026–2027 academic year, announced through the Higher Education Council (HEC) of Rwanda in partnership with the Chinese Ministry of Commerce.

This call is aimed at current Rwandan public servants seeking professional development in areas such as Public Administration, Business & Accounting, Engineering & ICT, Environmental Management, Education Leadership, International Relations & Law, Public Health, Agriculture, Journalism & Digital Media, and Artificial Intelligence.

The scholarship package includes full tuition fees, accommodation, monthly living allowance, international return flights, local transport in China, and medical insurance. Applicants must choose one programme from the 40 eligible Chinese universities, and the programme should be relevant to their academic background.

Notable participating universities mentioned include Peking University, Tsinghua University, Renmin University of China, China Agricultural University, Huazhong University of Science and Technology, East China Normal University, and Wuhan University.

Deadline: 28 April 2026.

How to apply: Submit your application through the HEC MIS portal and consult the full application guide before applying. Make sure your application is complete and submitted on time.

Funding details

Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.

How to apply

Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.

More information can be found here

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