Publisher
source

University of Twente

PhD Position in Hermetic Packaging of Microfluidic Sensor Chips for Medical Flow Systems University of Twente in Netherlands

Degree Level

PhD

Field of study

Chemistry

Funding

Available

Deadline

Sep 30, 2026

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Country

Netherlands

University

University of Twente

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Keywords

Chemistry
Biomedical Engineering
Mechanical Engineering
Electrical Engineering
Materials Science
Microfluidic
Physics

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About this position

PhD position at the University of Twente in the Integrated Devices and Systems (IDS) group, Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS), focused on microfluidics, MEMS, sensor packaging, and hermetic sealing for medical flow systems.

The project addresses a key challenge in ventilators and multi-infusion systems: how to connect a microfluidic sensor chip to the outside world without glue or elastomer seals. The research aims to develop a reliable glueless packaging technique for silicon chips with embedded microfluidic channels, using low-stress silicon-rich silicon nitride channel walls and exploring bonding of glass or metals to silicon nitride coated silicon wafers.

Research topics include bonding techniques, cleanroom fabrication, packaging of actual sensor chips, and performance evaluation in a MEMS measurement lab. The target seal must withstand pressures up to 30 bar and temperatures from -20°C to 70°C, while using inert materials suitable for medical applications.

The post is based in Enschede, the Netherlands. The candidate will work with guidance from senior scientists and a senior engineer, and may spend up to 20% of the time on teaching activities.

This is a PhD opening. The application deadline is 2026-09-30. Apply through the AcademicTransfer link provided in the post.

Funding details

Available

What's required

Applicants should be interested in MEMS, microfluidics, sensor packaging, bonding techniques, and experimental research. The project involves studying bonding of glass or metals to silicon nitride coated silicon wafers, carrying out bonding experiments, analyzing results, and designing/fabricating/packaging sensor chips in a cleanroom. The role includes evaluation in a MEMS measurement lab and may involve up to 20% teaching activities in the candidate's field of expertise.

How to apply

Apply via the AcademicTransfer application page. Review the vacancy details and submit your application through the portal before the deadline.

More information can be found here

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