PhD position on hermetic packaging of microfluidic sensor chips without glue or elastomers for ventilators and multi-infusion systems University of Twente in Netherlands

At the University of Twente, this PhD project addresses a key challenge in the translation of MEMS-based microfluidic sensor technology to demanding medical applications: how to package sensor chips hermetically without using glue or elastomer seals. The work is especially relevant for ventilators and multi-infusion systems, where wetted materials must be highly compatible with gases and pharmaceuticals and must not introduce unacceptable contamination, outgassing, or chemical interactions.

The project focuses on silicon chips with embedded microfluidic channels and low-stress silicon-rich silicon nitride channel walls. Research will investigate fundamental bonding approaches for joining glass or metals to silicon nitride coated silicon wafers, with the goal of developing a reliable glueless sealing technique. The final packaging solution should hermetically connect a MEMS-based microfluidic sensor to a fluidic adaptor and withstand pressures up to 30 bar over a temperature range from -20°C to 70°C. Only inert materials will be considered for the seal and adaptor to extend applicability in medical and other sensitive environments.

The research is hosted by the Integrated Devices and Systems (IDS) group in the Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS). IDS works on electronic and electromechanical components and develops nanoscale materials, devices, and systems using nano- and microfabrication techniques. The group combines semiconductor and MEMS expertise to design, fabricate, and characterise smart sensing devices, and is strongly linked to the MESA+ Institute, a multidisciplinary research environment in nanotechnology, microsystems, materials science, and microelectronics.

Planned work includes identifying promising bonding techniques, performing bonding experiments, analysing the results, designing and fabricating sensor chips in the MESA+ cleanroom, and evaluating packaging performance in the MEMS measurement lab. The PhD candidate will work at the University of Twente in Enschede, with guidance from senior scientists and support from a senior engineer. Up to 20% of the time may be dedicated to teaching activities in the candidate’s field of expertise.

The position is a four-year full-time PhD appointment with a qualifier in the first year. The University of Twente offers a stimulating research environment, training through the Twente Graduate School, and employment conditions under the Dutch collective labour agreement for universities. The salary ranges from €3,204 gross per month in the first year to €4,051 in the fourth year, with additional benefits including holiday allowance, end-of-year bonus, pension scheme, home-working flexibility, leave entitlement, and campus sports access.

Applicants should hold an MSc degree in electrical engineering, nanotechnology, applied physics, mechanical engineering, materials science, or a related discipline, and should have excellent theoretical and experimental skills. Experience or affinity with microfabrication, electronics, MEMS, and sensors is important, as is the ability to work well in an interdisciplinary and internationally oriented team. Fluency in English is required. The application deadline is 30 September 2026 at 23:59 CEST.