National Institute for Materials Science
3 days ago
Postdoctoral Research Fellow in Semiconductor Devices, Diamond and Two-Dimensional Materials National Institute for Materials Science in Japan
Degree Level
Postdoc
Field of study
Electrical Engineering
Funding
Full funding availableDeadline
Mar 31, 2027
Country
Japan
University
National Institute for Materials Science

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About this position
National Institute for Materials Science (NIMS) is recruiting a Postdoctoral Research Fellow (Semiconductor) in the Research Center for Materials Nanoarchitectonics (MANA), Surface Quantum Phase Materials Group in Japan.
The project focuses on the development of novel electronic devices through the integration of diamond and two-dimensional materials. The successful candidate will work on new electronic devices utilizing the properties of these advanced materials, with a strong connection to nanotechnology/materials science, semiconductor devices, thin film growth, microfabrication, device analysis, and surface/interface physics.
Eligibility: Applicants must hold a Ph.D. in Physics, Applied Physics, Materials Science and Engineering, or a related field by the start date. Preference is given to candidates with relevant research experience and an interest in wide bandgap semiconductors (such as SiC, GaN, and diamond) and two-dimensional materials (such as graphene and hexagonal boron nitride).
Funding: This is a paid postdoctoral contract position with an annual salary of about 4–5 million yen (monthly salary 325,360–385,626 JPY, depending on experience and abilities). Transportation expenses are provided under conditions, and standard health, pension, employment, and accident insurance are included.
Location: Ibaraki, Kanto district, Japan.
Application: Submit the specified documents online, including the NIMS CV, a brief summary of research accomplishments, and two references with positions, affiliations, and email addresses. The application window runs from 2026-07-13 to 2027-03-31, or until a suitable candidate is selected.
Funding details
Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.
How to apply
Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.
More information can be found here
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