Dong Hu

Delft University of Technology

Netherlands

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Articles (17)

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2025

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2024

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2024

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2024

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2022

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2022

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2021

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2021

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2021

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2020

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2020

Collaborators (11)

Guoqi Zhang

chair professor

Delft University of Technology

NETHERLANDS

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Leiming Du

Delft University of Technology

NETHERLANDS

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Willem van Driel

Delft University of Technology

NETHERLANDS

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Markus Alfreider

AUSTRIA

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René Poelma

Delft University of Technology

NETHERLANDS

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Huaiyu Ye

Delft University of Technology

NETHERLANDS

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Xuejun Fan

Lamar University

UNITED STATES

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Sten Vollebregt

Associate Professor

Delft University of Technology

NETHERLANDS

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Zhongchao Sun

Aalborg University

DENMARK

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Henry Antony Martin

Delft University of Technology

NETHERLANDS

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Luke Middelburg

Delft University of Technology

NETHERLANDS

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Dong Hu

Research Interests

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Articles (17)

Microstructural and mechanical anisotropy in pressure-assisted sintered copper nanoparticles

Prognostic Monitoring of Power QFN Packages with Silver Sintered Die-Attach Materials

Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging

Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste

Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging

Rapid on-site nondestructive surface corrosion characterization of sintered nanocopper paste in power electronics packaging using hyperspectral imaging

Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging

Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application

High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip

Effects of temperature and grain size on diffusivity of aluminium

High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging

Effects of Defect and Temperature on the Mechanical Performance of WS2: A Multiscale Analysis

Insights into the high-sulphur aging of sintered silver nanoparticles

基于非等径双球堆积模型和蒙特卡罗仿真模拟的纳米铜烧结互连机理分析

Low power AlGaN/GaN MEMS pressure sensor for high vacuum application

Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering

Collaborators (11)

Guoqi Zhang

Leiming Du

Willem van Driel

Markus Alfreider

René Poelma

Huaiyu Ye

Xuejun Fan

Sten Vollebregt

Zhongchao Sun

Henry Antony Martin

Luke Middelburg

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