Filipe Amarante dos Santos
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Recent Grants
Grant: Close
Rational Use of High Strength Concrete in Flat Slab Structures under Cyclic and Seismic Actions
Open Date: 2014-04-01
Close Date: 2015-09-01
Grant: Close
Rational Use of High Strength Concrete in Flat Slab Structures under Cyclic and Seismic Actions
Open Date: 2014-04-01
Close Date: 2015-09-30
Grant: Close
SUPERB - Seismic Unseating Prevention. Elements for Retrofitting of Bridges
Open Date: 2012-03-01
Close Date: 2015-11-01
Grant: Close
SUPERB - Seismic Unseating Prevention. Elements for Retrofitting of Bridges
Open Date: 2012-03-01
Close Date: 2015-11-15
Articles (16)
The mechanical analysis of photovoltaics and building integrated photovoltaics is a key step for their optimal design and certification, and requires careful consideration, alongside solar power, durability and functionality issues. The solar cells are encapsulated in thin interlayers that are usually composed of a viscoelastic Ethylene–Vinyl Acetate compound, and protected by thin glass and/or plastic layers. This paper investigates the out-of-plane bending response of a full-scale commercial PV module and focuses attention on the shear bonding efficiency of the thin encapsulant for quasi-static and dynamic mechanical considerations. The parametric analytical analysis, carried out in this study for a laminated glass plate, highlights the possible consequences of the viscoelastic shear coupling on the cross-section load-bearing demand in the covers. As a direct effect of severe operational conditions (i.e., ageing, non-uniform/cyclic thermal gradients, humidity, extreme mechanical/thermal loads, etc.) the shear rigidity and adhesion of these films can suffer from repeated/progressive modification and even degradation, and thus induce major stress and deflection effects in the out-of-plane mechanical response of the PV module components. The minimum shear bond efficiency required to prevent mechanical issues is calculated for various configurations of technical interest. Accordingly, it is shown how the quasi-static and dynamic mechanical performance of the system modifies as a function of a more rigid or weak shear coupling.
Year:
2024
In Part I of this study, it was shown that all the three known types of monohedral hexagonal tessellations of the plane, those composed of equal irregular hexagons, have just a single deformation mode when tiles are considered as rigid bodies hinged to each other along the edges. A gallery of tessellated plates was simulated numerically to demonstrate the range of achievable deformed shapes. In Part II, the displacement field was first derived and a continuous interpolant for each type of tessellated plate. It turns out that all corresponding metasurfaces are described by quadrics. Afterwards, a parametric analysis was carried out to determine the effect of varying angles and edge lengths on the curvature, and the values of the geometric Poisson ratio of the plates. Finally, a method of fabrication is proposed based on the additive manufacturing of stiff tiles of negligible deformability and flexible connectors. Using this modular technique, it is possible to join together different monohedral tessellated plates able to deform into piece-wise quadrics. The nodal positions in the deformed configuration of the realized plates are measured after enforcing one principal curvature to assume a chosen value. The estimate of the other principal curvature confirms the analytical predictions. The presented tessellated plates permit to realize doubly curved shape-morphing metasurfaces with assorted shapes, which also can feature a certain surface roughness, and they can be employed in all applications demanding high surface accuracy and few actuators or just one.
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2024
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2024
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2023
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2023
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2023
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2023
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2023
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2022
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2021
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2021
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2021
Collaborators (8)
Marco Fasan
University of Trieste
Corneliu Cismasiu
Professor Associado
Faculdade de Ciências da Universidade de Lisboa
CHIARA BEDON
Professore Associato
University of Trieste
Fernando Fraternali
University of Salerno
Marco Miniaci
Professionalizing Research grant
University of Bologna
Marco Picchi Scardaoni
University of Pisa
Simon D. Guest
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Roberto Paroni
Professor
University of Pisa
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