Guo-Quan Lu

Professor

Virginia Tech

United States

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Guo-Quan Lu is a Professor at Virginia Tech, USA. His research areas include power electronics packaging, thermal management of power modules, and the evaluation of material performance under high voltage conditions. Recent publications highlight advancements in sintered-silver die-attach techniques, nonlinear resistive polymer coatings, and cooling strategies for silicon carbide modules.

Articles (16)

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2025

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2024

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2024

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2022

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2022

Collaborators (3)

Khai Ngo

Professor

Virginia Tech

UNITED STATES

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Woongje Sung

UNITED STATES

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Cyril Buttay

Université Claude Bernard Lyon 1

FRANCE

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Guo-Quan Lu

Research Interests

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Articles (16)

Bonding and Failure Mechanisms of Sintered-Silver Die-Attach on Electroless Nickel (Phosphorus) Surface Finish for Packaging Power Electronics Modules

Insulation Capability at 10 kV, > 300 V/ns of a Nonlinear Resistive Polymer Nanocomposite Field-Grading Coating in a 15-kV Silicon Carbide Module

Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating

Effective Field Grading at 200 °C of a Nonlinear Resistive Polymer Nanocomposite Coating for Medium-Voltage Power Modules

Double-Sided Cooling Half-Bridge Power Module of 650 V/150 A Gallium Nitride High-Electron-Mobility Transistor

Local Interconnection Degradation of a Double-Sided Cooling SiC MOSFET Module Under Power Cycling

Double-Side Cooled SiC MOSFET Power Modules With Sintered-Silver Interposers for a 100-kW/L Traction Inverter

Chip Size Minimization for Wide and Ultrawide Bandgap Power Devices

Low Parasitic-Inductance Packaging of a 650 V/150 A Half-Bridge Module Using Enhancement-Mode Gallium-Nitride High Electron Mobility Transistors

On-Site Estimation of Thermal Resistance Degradation of Double-Sided Cooling (DSC) Power Modules Under Power Cycling Conditions

Copper-Wire Stress Buffers for Extending Lifetime of Double-Sided Bidirectional SiC Modules

Review of Double-Sided Cooling Power Modules for Driving Electric Vehicles

Packaging of a 10-kV Double-Side Cooled Silicon Carbide Diode Module With Thin Substrates Coated by a Nonlinear Resistive Polymer-Nanoparticle Composite

Improved Measurement Accuracy for Junction-to-Case Thermal Resistance of GaN HEMT Packages by Gate-to-Gate Electrical Resistance and Stacking Thermal Interface Materials

Reliability and Lifetime Prediction Model of Sintered Silver Under High-Temperature Cycling

Reliable Aluminum Wire-Bonded SiC/Si Diodes With Laminated Al/Cu Stress Buffers

Collaborators (3)

Khai Ngo

Woongje Sung

Cyril Buttay

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