Khai Ngo

Professor

Virginia Tech

United States

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Professor Khai Ngo is a faculty member at Virginia Tech in the United States. His research focuses on advanced power electronics, specifically involving Gallium Nitride and Silicon Carbide technologies, and the design and analysis of high-voltage modules. Recent publications include works on non-linear resistive polymer nanocomposites, isolated current source inverters, and innovative transformer designs for enhanced performance in power conversion systems.

Articles (18)

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2024

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2022

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2022

Collaborators (4)

Guo-Quan Lu

Professor

Virginia Tech

UNITED STATES

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Woongje Sung

UNITED STATES

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Cyril Buttay

Université Claude Bernard Lyon 1

FRANCE

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Ruizhe Zhang

Virginia Polytechnic Institute and State University

UNITED STATES

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Khai Ngo

Research Interests

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Articles (18)

Insulation Capability at 10 kV, > 300 V/ns of a Nonlinear Resistive Polymer Nanocomposite Field-Grading Coating in a 15-kV Silicon Carbide Module

Analysis and Design of an Isolated Current Source Class-E Inverter With Significant Harmonics

Hybrid Electronic-Embedded Transformer-Based DC Transformer (EET-DCX): A New Family of Soft-Switching DCXs

Resonant Commutation Electronic-Embedded DC Transformer (RC-EET DCX) With Quasi-Trapezoidal Current and Natural Current Sharing

Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating

Effective Field Grading at 200 °C of a Nonlinear Resistive Polymer Nanocomposite Coating for Medium-Voltage Power Modules

An Improved Class-E Current Inverter With Two Coupled Inductors for Isolation and Power Scaling Without Affecting Switch Voltage Stress

Double-Sided Cooling Half-Bridge Power Module of 650 V/150 A Gallium Nitride High-Electron-Mobility Transistor

A Scalable Electronic-Embedded Transformer, a New Concept Toward Ultra-High-Frequency High-Power Transformer in DC–DC Converters

Double-Side Cooled SiC MOSFET Power Modules With Sintered-Silver Interposers for a 100-kW/L Traction Inverter

Chip Size Minimization for Wide and Ultrawide Bandgap Power Devices

Low Parasitic-Inductance Packaging of a 650 V/150 A Half-Bridge Module Using Enhancement-Mode Gallium-Nitride High Electron Mobility Transistors

Robust Avalanche in 1.7 kV Vertical GaN Diodes with a Single-Implant Bevel Edge Termination

Packaging of a 10-kV Double-Side Cooled Silicon Carbide Diode Module With Thin Substrates Coated by a Nonlinear Resistive Polymer-Nanoparticle Composite

Synthesis of PWM Converters From Conversion Ratios Using Flux- or Charge-Balance Equations

Degradation of SiC MOSFETs Under High-Bias Switching Events

Steady-State Analysis of Series-Resonator Buck Converter

Improved Measurement Accuracy for Junction-to-Case Thermal Resistance of GaN HEMT Packages by Gate-to-Gate Electrical Resistance and Stacking Thermal Interface Materials

Collaborators (4)

Guo-Quan Lu

Woongje Sung

Cyril Buttay

Ruizhe Zhang

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