Hiroaki Tatsumi

Associate Professor

Osaka University

Japan

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About

Hiroaki Tatsumi is an Associate Professor at Osaka University, Japan. His research focuses on interfacial reactions and microstructure in soldering processes, including the analysis of Ag-based materials and bonding mechanisms. Recent articles highlight his work on whisker growth in satellites, nano-dendritic structures, and the reliability of solder joints in power devices.

Articles (19)

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2025

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2021

Collaborators (3)

Takahiro Kozawa

Assistant Professor

Osaka University

JAPAN

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Tomoki Matsuda

Osaka University

JAPAN

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Zhong Chen

Professor/Associate Professor/Assistant Professor

Nanyang Technological University (NTU)

SINGAPORE

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Hiroaki Tatsumi

Research Interests

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About

Articles (19)

Lead whisker growth characteristics on satellites in Earth orbit

Effect of copper on interfacial reaction and microstructure of soldering on aluminum substrate

Direct formation of Cu nano-dendritic structure on substrate by dynamic hydrogen bubble template for organic-free sintered Cu-to-Cu bonding

Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging

Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint

Transparent Liquid Ag-Based Complex for the Facile Preparation of Robust Sintered Ag Joints in Power Devices

Analysis of microstructures and fractures in Ag–In transient liquid phase bonded joints

Interfacial reactions between In and Ag during solid liquid interdiffusion process

Quasi-direct Cu–Si3N4 bonding using multi-layered active metal deposition for power-module substrate

Substrate-Dependent Sintering Mechanism of Ag Nanostructures Derived from Ag-Based Complex

Fabrication and thermo-mechanical properties of Ag9In4 intermetallic compound

Reliability-enhanced microscale Ag sintered joint doped with AlN nanoparticles

The electromigration study of thin-film structured Sn3.5Ag and Ag using continuous observation and reliability enhancement approach

Strength-enhanced Sn–In low-temperature alloy with surface-modified ZrO2 nanoparticle addition

Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints

Anisotropic highly conductive joints utilizing Cu-solder microcomposite structure for high-temperature electronics packaging

Highly efficient soldering of Sn-Ag-Cu solder joints using blue laser

Solid-state bonding behavior between surface-nanostructured Cu and Au: a molecular dynamics simulation

Pressureless sinter joining of bare Cu substrates under forming gas atmosphere by surface-oxidized submicron Cu particles

Collaborators (3)

Takahiro Kozawa

Tomoki Matsuda

Zhong Chen

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