Tomoki Matsuda

Osaka University

Japan

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Articles (19)

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2025

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2020

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2020

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2020

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2020

Collaborators (6)

Hiroaki Tatsumi

Associate Professor

Osaka University

JAPAN

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Kazuto Arakawa

Vice Director, Professor

Shimane University

JAPAN

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YUSUKE SETO

Osaka University

JAPAN

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Masahiro Yasutake

Japan Synchrotron Radiation Research Institute

JAPAN

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Masaya Shigeta

Tohoku University

JAPAN

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Naohiko Sugita

Professor

University of Tokyo

JAPAN

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Tomoki Matsuda

Research Interests

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Articles (19)

Evaluation of thermal anisotropic evolution in the sinter structure of direct sinter joining to silicon via coupled microstructural characterizations

Enhancing post-bonding oxidation resistance of low-pressure Cu sintered joints via residual reductant retention

Current-assisted low-temperature silver sinter bonding to silicon carbide by utilizing ion migration

Direct measurement of lattice behavior during femtosecond laser-driven shock front formation in copper

Lowering temperature of Cu sinter bonding under low-pressure in ambient air by in-situ generation and reduction of Cu2O nanoparticles

Convection and joint characteristics in aluminum alloy melting zone during resistance spot welding of dissimilar Fe-Al material in external magnetic field

Ag Sinter Bonding to Si Substrate via Temporal Formation and Decomposition of Ag Carboxylate

Highly strong interface in Ag/Si sintered joints obtained through Ag2O–Ag composite paste

A study on convection in molten zone of aluminum alloy during Fe/Al resistance spot welding

Crack initiation and propagation behavior of dissimilar interface with intermetallic compound layer in Al/steel joint using coupled multiscale mechanical testing

Antioxidative copper sinter bonding under thermal aging utilizing reduction of cuprous oxide nanoparticles by polyethylene glycol

Influence of pulse duration on mechanical properties and dislocation density of dry laser peened aluminum alloy using ultrashort pulsed laser-driven shock wave

Fracture dominant in friction stir spot welded joint between 6061 aluminum alloy and galvannealed steel based on microscale tensile testing

Reduction Behavior of Surface Oxide on Submicron Copper Particles for Pressureless Sintering Under Reducing Atmosphere

Pressureless sinter joining of bare Cu substrates under forming gas atmosphere by surface-oxidized submicron Cu particles

Lowering bonding temperature for silver sintering to silicon and silicon carbide using silver oxide decomposition

Microscale tensile test of galvannealed steel/aluminum dissimilar joint for estimation of intrinsic interfacial strength

Effect of mismatch in mechanical properties on interfacial strength of aluminum alloy/steel dissimilar joints

Influence of interfacial structure on the fracture behavior of friction stir spot welded dissimilar joints

Collaborators (6)

Hiroaki Tatsumi

Kazuto Arakawa

YUSUKE SETO

Masahiro Yasutake

Masaya Shigeta

Naohiko Sugita

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