Jason A. Burdick

Country flagUnited States

Research Interests

Explore related searches

Contact this professor

Get a free first email built on one of their papers, ready for you to edit and send yourself.

Articles (3)

Year:

2025

Year:

2025

Volumetric additive manufacturing (VAM) is an emerging layerless method for the rapid processing of reactive resins into 3D structures, where printing is much faster (seconds) than other lithography and direct ink writing methods (minutes to hours). As a vial of resin rotates in the VAM process, patterned light exposure defines a 3D object and then resin that has not undergone gelation can be washed away. Despite the promise of VAM, there are challenges with the printing of soft hydrogel materials from non‐viscous precursors, including multi‐material constructs. To address this, sacrificial gelatin is used to modulate resin viscosity to support the cytocompatible VAM printing of macromers based on poly(ethylene glycol) (PEG), hyaluronic acid (HA), and polyacrylamide (PA). After printing, gelatin is removed by washing at an elevated temperature. To print multi‐material constructs, the gelatin‐containing resin is used as a shear‐yielding suspension bath (including HA to further modulate bath properties) where ink can be extruded into the bath to define a multi‐material resin that can then be processed with VAM into a defined object. Multi‐material constructs of methacrylated HA (MeHA) and gelatin methacrylamide (GelMA) are printed (as proof‐of‐concept) with encapsulated mesenchymal stromal cells (MSCs), where the local hydrogel properties guide cell spreading behavior with culture.

Year:

2024

Collaborators (3)

ROBERT MCLEOD

University of Colorado Boulder

UNITED STATES
View details

Christopher N. Bowman

University of Colorado Boulder

UNITED STATES
View details

Alex Hughes

Assistant Professor

University of Pennsylvania

UNITED STATES
View details
ApplyKite TwinLearns as you apply

Make your next move.

Prepare your application

Review drafts before you send them.