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Mohd Sharizal Abdul Aziz

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Associate Professor

Universiti Sains Malaysia (USM)

Malaysia

Research Interests

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Professors in Condensed Matter Physics

Recent Grants

Grant: Open

Revolutionizing Sanitary Waste Management: Implementing Innovative Sanitary Napkin Incinerators

Open Date: 2024-07-01

Close Date: 2027-06-01

Grant: Open

Thermal fluid structure interaction on the effect of 3D stacked die and configuration of Cu-Cu direct advanced packaging technology

Open Date: 2024-06-01

Close Date: 2027-05-01

Grant: Close

Elucidating the Impact of AgNP Nanocoating on Heat Sink dissipation capacity using Molecular Dynamics

Open Date: 2023-10-01

Close Date: 2025-09-01

Grant: Close

Mechanism of NiO nano-reinforcement agglomeration and its relation to micro-voids formation in nano-reinforced solder copper pillar bump

Open Date: 2020-11-01

Close Date: 2023-04-01

Articles (20)

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Collaborators (2)

Wan Rahiman

Universiti Sains Malaysia (USM)

MALAYSIA

View details

Krishnamoorthy Ramalingam

Senior Lecturer

Universiti Sains Malaysia (USM)

MALAYSIA

View details

ApplyKite TwinLearns as you apply

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Mohd Sharizal Abdul Aziz

Research Interests

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Recent Grants

Articles (20)

Multi-Objective density optimization of Cu-Cu bonded stacked dies under thermal cycling via desirability function analysis

Interconnect diameter effects on the thermo-mechanical reliability of sandwich-structured Cu–Cu bonded stacked dies

Cu–Cu bonding process in 3D integrated circuits: thermo-mechanical coupling challenges and reliability-driven solutions

Impacts of impeller blade number on centrifugal pump performance under critical cavitation conditions

Strategic partial silver nanoparticles coating in enhancement of heat Sink's thermal performance

Multiparameter and multi-objective optimization and loss analysis based on orthogonal and entropy generation methods for centrifugal pump

Influence of Pipe Cross-Sectional Geometry on Thermal and Hydraulic Characteristics of Radiant Ceiling Cooling Systems

Effect of Ga additions as micro-alloying element to microstructure formation, thermal properties and mechanical properties of Sn-0.7Cu solder alloy

Comprehensive review of critical infrastructure monitoring approaches and prospective routes to dam sustainability in the face of climate change instability

Influence of Heat Sink Material and Surface Coatings on Passive Cooling Thermal Performance

Energy-driven thermo-mechanical reliability in direct Cu–Cu bonded 3D ICs

The effects of indium on the microstructural evolution, lattice characteristics, thermal stability and mechanical performance in Sn-3.0Ag-0.5Cu solder alloys

Effect of Cu-Cu Hybrid Bonding Height in the 3D Stacked Die Configuration: Thermal-Structural Analysis

Impact of Bismuth as Microalloying Element in Sn-0.7Cu Lead-Free Solder Alloys

Influence of Temperature on Flexible Printed Circuit Board During Reflow Soldering

The impact of modifying the blade trailing edge configuration on centrifugal pump performance: Entropy generation and fluid–structure interaction analysis

Thermal management of cylindrical lithium-ion batteries with different fin configurations and phase change material: a numerical analysis

Thermal–optical trade-offs in on-water bifacial photovoltaic systems: Tilt-angle evaluation in a below-sea-level semi-arid region

Effect of Epoxy Material Viscosity and Gold Wire Configuration on Light-Emitting Diode Encapsulation Process

The Influence of Gold Wire Quantity on the Encapsulation of Light-Emitting Diodes

Collaborators (2)

Wan Rahiman

Krishnamoorthy Ramalingam

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