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Sukkyung Kang

Assistant Professor

Hanyang University

South Korea

Research Interests

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Articles (17)

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2026

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2026

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2026

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2024

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2023

Collaborators (7)

Junseong Ahn

Assistant Professor

Korea University

SOUTH KOREA

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Seunghwa Ryu

Professor

Korea Advanced Institute of Science and Technology

SOUTH KOREA

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Hongki Yoo

Associate Professor

KAIST

SOUTH KOREA

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Bong Jae Lee

Professor

KAIST

SOUTH KOREA

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Eun-Ho Lee

Associate Professor

Sungkyunkwan University

SOUTH KOREA

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Yongrok Jeong

Assistant Professor

Kyungpook National University

SOUTH KOREA

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YOUNG JIN KIM

KWON OH-HYUN Associate Professor

Korea Advanced Institute of Science and Technology

SOUTH KOREA

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Sukkyung Kang

Research Interests

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Articles (17)

Data-free physics-informed inverse programming of bistable kirigami energy landscapes

Asymmetric-beam steady-state thermoreflectance for three-dimensional anisotropic thermal conductivity measurements

Carbon nanotube sandpaper for atomic-precision surface finishing

Challenges and Innovations in Chemical Mechanical Polishing in the More-than-Moore Era

Chemical Mechanical Polishing of Plasma‐Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding

Surface-modified anode current collectors via lithiophilic zinc-based bimetallic co-electrodeposition for lithium–metal batteries

Nanometer-resolution white-light scanning interferometry for surface-profiling of hybrid bonding samples for advanced semiconductor packaging

Frequency-comb-referenced Terahertz Fabry-Pérot interferometry for monitoring semiconductor wafer thinning process with a nanometer precision

Modeling framework and discussion of microstructural effects on the formation of Cu–Cu bonding interfaces in semiconductor stacking

Effects of grain size on bonding performance of Cu-to-Cu bonding

An Ionic Gelation Powder for Ultrafast Hemostasis and Accelerated Wound Healing

Characteristics of PVD SiCN for Application in Hybrid Cu Bonding

Analysis of torque variation in bolt fastening on coated steel surfaces

Mitigation of Cu dishing in chemical mechanical polishing using micro-structured pads

Nanotransfer Printing for Synthesis of Vertically Aligned Carbon Nanotubes with Enhanced Atomic Penetration

Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition

Advanced Cu/Polymer Hybrid Bonding System for Fine‐Pitch 3D Stacking Devices

Collaborators (7)

Junseong Ahn

Seunghwa Ryu

Hongki Yoo

Bong Jae Lee

Eun-Ho Lee

Yongrok Jeong

YOUNG JIN KIM

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