Tadatomo Suga

Professor

Meisei University

Japan

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Articles (11)

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2024

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2023

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2023

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2021

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2020

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2020

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2020

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2020

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2020

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2020

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2020

Collaborators (2)

Yuichi Kurashima

National Institute of Advanced Industrial Science and Technology

JAPAN

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Eiji Higurashi

Professor

Tohoku University

JAPAN

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Tadatomo Suga

Research Interests

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Contact this professor

Articles (11)

Elucidating the formation mechanisms of the parasitic channel with buffer-free GaN/Si hetero-bonding structures

Room temperature bonding of Au assisted by self-assembled monolayer

Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration

A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature

Room-temperature pressureless wafer-scale hermetic sealing in air and vacuum using surface activated bonding with ultrathin Au films

Direct bonding of high dielectric oxides for high-performance transistor applications

Enhanced adhesion and anticorrosion of silk fibroin coated biodegradable Mg-Zn-Ca alloy via a two-step plasma activation

Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices

Rapid pressureless and low-temperature bonding of large-area power chips by sintering two-step activated Ag paste

Recycled low-temperature direct bonding of Si/glass and glass/glass chips for detachable micro/nanofluidic devices

Robust Ag‐Cu sintering bonding at 160 °C via combining Ag<inf>2</inf>O microparticle paste and pt‐catalyzed formic acid vapor

Collaborators (2)

Yuichi Kurashima

Eiji Higurashi

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