Vesa Vuorinen

Electronics Integration and Reliability (EILB) at Aalto University School of Electrical Engineering is seeking a doctoral researcher to work on the next generation of high-density power electronics. The group develops innovative materials, device design, and bonding technologies for wide-bandgap and ultra-wide-bandgap semiconductor systems, with applications extending to RF devices and smart sensors. The project centers on miniaturised heterogeneous integration for power electronics, using novel high-temperature interconnects such as solid–liquid interdiffusion, hybrid and diffusion bonding, and sintering. The research will examine how interconnect compatibility, metallurgy, microstructures, and local interface defects affect electrical and thermal performance as well as the long-term reliability of power electronic modules. The successful candidate will help design, manufacture, and characterise highly integrated, ultra-high-power-density power modules and “power chiplets”. The work combines advanced materials characterisation, electrical and thermal measurements, and multiphysics modelling to support innovative control and sensing functions in compact power systems. The doctoral researcher will work in a collaborative environment that includes international research partners and participation in large national and pan-European public-private partnership projects. The position is based at Aalto University’s OtaNano infrastructure, with opportunities to use Micronova and the Nanomicroscopy Center for research and characterisation. The role sits within a broader Aalto research environment focused on science, technology, innovation, and multidisciplinary collaboration in Espoo, Finland.