Flash Ablation Metalization of 3D Printed Components DEVCOM Army Research Laboratory in United States

Keysight Technologies is hiring recent graduates for process engineering roles in semiconductor wafer fabrication and advanced semiconductor packaging. The opportunities are intended for graduates who want to apply research experience to industrial semiconductor technology and manufacturing processes. The wafer fabrication role focuses on process engineering in semiconductor manufacturing, while the advanced packaging role concerns process development and integration for next-generation semicond...

North Carolina Agricultural and Technical State University is seeking a Postdoctoral Research Associate to work on Quantum & Battlefield Information Dominance (Q-BID) . The research is part of the Department of War-funded Accelerate-DAQ initiative and spans quantum-relevant materials and nanoscale devices, advanced and quantum sensing, secure electronic and sensing readout, hybrid quantum-classical approaches, and fault-aware hardware for edge applications. Candidates should hold a Ph.D. in Nano...

DEVCOM Army Research Laboratory is offering a post-doctoral fellowship through the Applied Physics Branch at Aberdeen Proving Ground, Maryland. The project sits within the Army’s research environment and is tied to the Weapons and Materials Research Directorate, where research supports survivability, protection, and advanced technologies for defense applications. The fellowship focuses on signature exploitation and reduction , with an emphasis on understanding the electromagnetic spectrum and th...

Argonne National Laboratory’s Materials Science Division is inviting applications for a postdoctoral appointment in terahertz cavity antiferromagnonics . The project sits at the intersection of physics , materials science , and electrical engineering , with a strong emphasis on terahertz resonators, antiferromagnetic spin excitations, cavity spintronics, and coherent light-matter interaction. The successful candidate will work on developing terahertz cavity-magnonics platforms based on low-dampi...

Rochester Institute of Technology is advertising an immediate Postdoctoral Associate opening in Photonic Integrated Circuit (PIC) Packaging with Professor Stefan Preble in Microsystems Engineering. The research focuses on enabling emerging PIC applications through microtransfer printing and 3D nanopatterning , including photonic wire bonds and micro-optics . This is a strong fit for candidates interested in photonics, integrated photonic devices, nanofabrication, and advanced packaging technolog...