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University of Arkansas
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Postdoctoral Research Scientist III in Advanced Power Electronics Packaging University of Arkansas in United States
Degree Level
Postdoc
Field of study
Mechanical Engineering
Funding
Fixed-term, externally funded research position; salary is commensurate with education and experience. Position is renewable annually based on continued need, funding availability, and satisfactory performance.
Deadline
Dec 14, 2026
Country
United States
University
University of Arkansas
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About this position
The University of Arkansas is seeking a postdoctoral research scientist to work on advanced power electronics packaging for next-generation power conversion systems. The project focuses on advanced power semiconductor modules and packaging technologies for wide-bandgap and ultra-wide-bandgap devices, with voltage ratings from 650 V to over 10 kV.
The successful researcher will contribute to externally funded work supporting electric transportation, renewable energy, solid-state transformers, energy storage, and other high-power-density applications. The role involves modelling, simulation, fabrication, and experimental characterization of advanced module packaging concepts, with attention to electrical, thermal, mechanical, reliability, and manufacturability aspects.
This position is part of the University of Arkansas research environment in Fayetteville and includes collaboration with faculty, students, industry partners, semiconductor manufacturers, material and packaging suppliers, and other research organizations. The post is housed with the Graduate Assistants, Hourly Employees & UAPG Staff department and is connected to the university power group website.
The appointment is a fixed-duration research role with annual renewal depending on need, funding, and performance.
Funding details
Fixed-term, externally funded research position; salary is commensurate with education and experience. Position is renewable annually based on continued need, funding availability, and satisfactory performance.
What's required
A Ph.D. in Electrical Engineering or a closely related field from an accredited institution is required and must be conferred by the start date. Applicants must have research experience in power module packaging or closely related power semiconductor packaging technologies and experience in the design, simulation, fabrication, and/or experimental characterization of power semiconductor modules. Preferred qualifications include experience with packaging materials and fabrication processes (baseplates, substrates, die attach, soldering, sintering, wire/ribbon bonding, wire-bondless interconnects, encapsulation), multiphysics modelling and simulation tools such as ANSYS Q3D, Maxwell, Workbench, or LTspice, experimental characterization methods such as curve-tracer characterization, double-pulse testing, Hi-Pot testing, partial discharge testing, and switching performance evaluation, and familiarity with CAD tools such as SolidWorks. Strong analytical, organizational, interpersonal, written, and oral communication skills are needed, and experience mentoring students is desirable.
How to apply
Apply through the University of Arkansas System Career Site in Workday. Upload a curriculum vitae and a list of three professional references with names, email addresses, and business titles. Do not send application materials to the recruitment contacts by email.
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Make your next move.
Prepare your application
Review drafts and confirm requirements with the university.