Debdeep Jena

The growth of α-Ga2O3 and α-(InxGa1−x)2O3 on m-plane α-Al2O3(101̄0) by molecular beam epitaxy (MBE) and metal-oxide-catalyzed epitaxy (MOCATAXY) is investigated. By systematically exploring the parameter space accessed by MBE and MOCATAXY, phase-pure α-Ga2O3(101̄0) and α-(InxGa1−x)2O3(101̄0) thin films are realized. The presence of In on the α-Ga2O3 growth surface remarkably expands its growth window far into the metal-rich flux regime and to higher growth temperatures. With increasing O-to-Ga flux ratio (RO), In incorporates into α-(InxGa1−x)2O3 up to x ≤ 0.08. Upon a critical thickness, β-(InxGa1−x)2O3 nucleates and, subsequently, heteroepitaxially grows on top of α-(InxGa1−x)2O3 facets. Metal-rich MOCATAXY growth conditions, where α-Ga2O3 would not conventionally stabilize, lead to single-crystalline α-Ga2O3 with negligible In incorporation and improved surface morphology. Higher TTC further results in single-crystalline α-Ga2O3 with well-defined terraces and step edges at their surfaces. For RO ≤ 0.53, In acts as a surfactant on the α-Ga2O3 growth surface by favoring step edges, while for RO ≥ 0.8, In incorporates and leads to a-plane α-(InxGa1−x)2O3 faceting and the subsequent (2̄01) β-(InxGa1−x)2O3 growth on top. Thin film analysis by scanning transmission electron microscopy reveals highly crystalline α-Ga2O3 layers and interfaces. We provide a phase diagram to guide the MBE and MOCATAXY growth of single-crystalline α-Ga2O3 on α-Al2O3(101̄0).

Here, we report that a source of Si impurities commonly observed on (010) β-Ga2O3 is from exposure of the surface to air. Moreover, we find that a 15 min hydrofluoric acid (HF) (49%) treatment reduces the Si density by approximately 1 order of magnitude on (010) β-Ga2O3 surfaces. This reduction in Si is critical for the elimination of the often observed parasitic conducting channel, which negatively affects transport properties and lateral transistor performance. After the HF treatment, the sample must be immediately put under vacuum, for the Si fully returns within 10 min of additional air exposure. Finally, we demonstrate that performing a 30 min HF (49%) treatment on the substrate before growth has no deleterious effect on the structure or on the epitaxy surface after subsequent Ga2O3 growth.