Resilient Materials, Devices, and Sensors DEVCOM Army Research Laboratory in United States

This postdoctoral position at Rochester Institute of Technology centers on advanced power electronics and energy conversion systems , with a particular emphasis on high-power back-to-back converters and solid-state transformer technologies . The researcher will develop and integrate converter technology toward an integrated Solid-State Transformer architecture , contributing to both modelling and experimental implementation. Working under the supervision of Dr. Liwei Zhou , the postdoctoral rese...

NaMLab is advertising a Junior Scientist (PhD candidate) opening in nanoelectronics . The post is aimed at candidates with a background in clean room fabrication and electrical engineering , suggesting a research profile centered on device fabrication, semiconductor processing, and experimental nanoelectronic systems. The opportunity is shared by Jens Trommer , Senior Scientist at NaMLab, who says the position is in my research group . This indicates a group-owned PhD opening rather than a repos...

Argonne National Laboratory’s Materials Science Division is inviting applications for a postdoctoral appointment in terahertz cavity antiferromagnonics . The project sits at the intersection of physics , materials science , and electrical engineering , with a strong emphasis on terahertz resonators, antiferromagnetic spin excitations, cavity spintronics, and coherent light-matter interaction. The successful candidate will work on developing terahertz cavity-magnonics platforms based on low-dampi...

PhD opportunity for Fall 2027 at Northeastern University in silicon photonics and integrated photonics , through the UIDP Industry-Integrated PhD (I-PhD) project with Hewlett Packard Enterprise (HPE) . The position is part of an NSF-supported national pilot that combines doctoral research with sustained industry R&D experience. The student will be jointly mentored by Northeastern and HPE researchers and based in the lab on Northeastern’s Oakland campus in the Bay Area. The post is especially rel...

Rochester Institute of Technology is advertising an immediate Postdoctoral Associate opening in Photonic Integrated Circuit (PIC) Packaging with Professor Stefan Preble in Microsystems Engineering. The research focuses on enabling emerging PIC applications through microtransfer printing and 3D nanopatterning , including photonic wire bonds and micro-optics . This is a strong fit for candidates interested in photonics, integrated photonic devices, nanofabrication, and advanced packaging technolog...